Heat sink compound how much

These are pre-applied to thermal pads which are then placed between the processor and the heatsink. So, if the need ever arose to replace the cooler, for example, there would be problems in doing so.

Getting the wrong kind of paste will not only increase the PC temperature but it may also worsen its performance. These are a few factors for computer enthusiasts to consider before purchasing a thermal compound that will work best to improve the temperature, as well as the performance of their PC.

The second factor to consider is the thermal conductivity of the paste. Each thermal paste comes with its own thermal conductivity rating for how efficient it is at transferring heat from the processor to the heatsink.

Liquid and non-metallic compounds have different conductivity levels. As a general rule, the higher the number rating, the better the compound is going to be at heat conduction. This will allow it to squeeze throughout the CPU easily. When choosing the right paste, care must also be taken to ensure that the paste has the right consistency for applying it directly to the CPU or GPU without risking damage to the components.

The higher the viscosity of the compound, the thicker it will be so that it looks more like an actual paste. This type of paste is typically better for sticking the heat sink compound to the processor.

Compounds with lower viscosity are typically more liquid, and these tend to leak onto the motherboard easily when too much of the compound is used. A compound with low conductivity can also be chosen to allow application without shorts, even if the paste touches any of the electrical components. The thermal design power shows the amount of power that a processor is going to use.

This can be used as an estimate to determine how hot it is going to get. A processor with higher TDP is likely to use more power and, therefore, generate a lot more heat. This is something else to consider when choosing the best thermal compound to ensure that it can handle the heat generated to keep the components safe, cool, and performing at their best.

The TDP is listed on the processor specs. Even with the best thermal compound on the market, it will be next to impossible to bring down the temperature of a system if the cooling solution being used is not a very effective one. Use only a pea-sized amount of paste. Apply it to the center in order to allow the heatsink to push the substance down onto the CPU.

This is a great technique to prevent spreading the paste over the heat spreader and the method works particularly well with less viscous solutions.

When using a liquid compound, apply a paper-thin layer over your CPU using just a dot of the substance on either side of the CPU.

Most manufacturers specify a shelf life of up to three years for packages that are unopened. However, that does not take into consideration the date the tube was produced. This means that even when enthusiasts buy compounds new, they may have been sitting on some shelf for quite a while which makes it likely that the compound has already degraded.

This buying guide is a great resource to use when searching for the best thermal compound to keep any system cool and enhance performance dramatically. Christian is a tech enthusiast with a strong background in computer systems and smart devices. You'll find Christian writing about computer components, electronics, smart devices, and more. He's a content creator by day and a hardcore gamer by night.

Inefficiencies in the thermal transfer occur because two flat surfaces, e. CPU and mechanical heat sink, never join together perfectly. Inevitably, there is an air gap because of imperfect surfaces. Because air is a relatively bad thermal conductor, this gap can lead to a reduction in heat dissipation, and result in an overheating and failing device.

Heat sink compound is used to fill that gap and is designed to efficiently transfer the heat from the heat generating component to the heat dissipating device. Although the heat sink compound does not have the thermal conductivity of metals like copper and silver, its conductivity improvement over the air will increase thermal responsiveness. NOTE: Conductivity may vary depending on material type.

Measurements taken at room temperature. Heat sink compound does not mechanically connect devices like thermal adhesive does. The mechanical heat sink must be firmly attached using screws or other means to minimize the space between the sink and the source. Techspray offers two formulas of heat sink compound, silicone part DP and silicone-free part DP and Thermal paste also known as thermal grease, thermal interface material, or thermal gel is the semi-fluid compound you apply to the metal housing of the CPU to allow efficient heat transfer to the cooler mounted directly above it.

Before we get started: thermal paste is applied to the top of the CPU, not the bottom. It should applied to the smooth metal plate where the manufacturer and model information is printed , not to to the hundreds of squares or pins on the underside.

Worried about what kind of thermal paste to use? If you apply too little paste and your CPU runs too hot resulting in computer crashes, you can always clean it off and reapply, but cleaning paste out of the socket itself is much more problematic. Once you have the paste applied as above, simply set the cooler on top and screw it into place on the motherboard with its included mounting hardware.

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